Wire solder fluxe

TECHNICAL DATA SHEET

Standard ISO 9453 :2015

Products developed for manual and automatic applications.

Alloys offered according to standards EN ISO 9653 :2015, EN 691190-1-3 :2007 and directive RoHS.

Fluxe according standard EN-ISO 29454-1 / J-STD-004.

 

Sn

 

Cu

 

Ag

EN-ISO 9453 B1.1

Resin

halogen

B1.2

Resin

halogen free

B2.1

Rosin

halogen

B2.2

Rosin

free

 

Temperature

°C

99.3 0.7 401 x x x x 222°C eutectic
97 3 702 x x x x 221-224°C
97 3 402 x x x x 227-310°C
96.5 3 0.5 711 x x x x 217-220°C
99 0.7 0.3 501 x x x x 217-226°C
95.5 0.7 3.8 713 x x x x 217-226°C
96.3 3.7 701 x x x x 221-228°C
REM1 REM0 ROM1 ROM0
Rosin Free

Flux compatible EN-ISO 29454 / J-STD-004

Flux conforme EN-ISO29454 / J-STD-004

 

Name EN-ISO

29454-1

J-STD-004 Description
B2.2 1.1.3.B ROM0  Halogen free rosin for electronic assembly application

Quick wetting and good propagation

Low residue

B2.1 1.1.2.B ROM1 Activated rosin (contains halogens) for fast spreading surface.

Also suitable for robotic soldering and repair

B1.2 1.2.3.B REM0 Halogen free resin. Good propagation on copper, brass and nickel.
B1.1 1.2.2.B REM1 Activated resin (contains halogen). Developed to meet the higher process temperatures associated with lead-free solders.

Other alloys and flux on request