Alloy Sn/Cu

Alloy S-Sn99,3 Cu0,7

General Characteristics                                        

Lead-free binary solder alloy used in the electronics and allied industries.

• Eutectic alloy with 0.7% copper. Melting point at 227 ° C.
• Very good mechanical resistance.
• Bright alloy, not tarnishing.
• Very good electrical conductivity.
• Lead-free

Standard :

• International :        Metal : ISO 9453      Flux : ISO 9454.1
• French:                      Metal : NF   EN 29453 – C 90550

Physico-Chimical Characteristics

• Tin rate, Sn : …………………………….. Rest
• Copper rate, Cu : ………………………… 0.45 % à 0.9 %
• Melting temperature : ………………….. 227°C
• Specific gravity : …………………………. 7.3
• Mechanical Strength : ………………….. Brinell hardness: 14
• Electric conductance: …………………… 14 % IACS
• Electric resistance: …………………………… 12 µ Ώ cm
• Temperature of use for soldering iron: 380°- 390° C

QUALITY INSURANCE

Each delivery is identified by its manufacturing batch with the corresponding certificate of analysis

 Standard

• International :                       Metal : ISO 9453 Flux : ISO 9454.1
•  French:                                    Metal : NF   EN 29453 – C 90550