Alloy Sn/Cu
Alloy S-Sn99,3 Cu0,7
General Characteristics
Lead-free binary solder alloy used in the electronics and allied industries.
- Eutectic alloy with 0.7% copper. Melting point at 227 ° C.
- Very good mechanical resistance.
- Bright alloy, not tarnishing.
- Very good electrical conductivity.
- Lead-free
Standard :
- International : Metal : ISO 9453 Flux : ISO 9454.1
- French: Metal : NF EN 29453 – C 90550
Physico-Chimical Characteristics
- Tin rate, Sn : …………………………….. Rest
- Copper rate, Cu : ………………………… 0.45 % à 0.9 %
- Melting temperature : ………………….. 227°C
- Specific gravity : …………………………. 7.3
- Mechanical Strength : ………………….. Brinell hardness: 14
- Electric conductance: …………………… 14 % IACS
- Electric resistance: …………………………… 12 µ Ώ cm
- Temperature of use for soldering iron: 380°- 390° C
QUALITY INSURANCE
Each delivery is identified by its manufacturing batch with the corresponding certificate of analysis
Standard
- International : Metal : ISO 9453 Flux : ISO 9454.1
- French: Metal : NF EN 29453 – C 90550