SnCU 99.3/0.7 Solder Wire without flux

Reference: SnCU 99.3/0.7
TECHNICAL DATA SHEET

Alloy Sn/Cu

Alloy S-Sn99,3 Cu0,7

General Characteristics                                        

Lead-free binary solder alloy used in the electronics and allied industries.

  • Eutectic alloy with 0.7% copper. Melting point at 227 ° C.
  • Very good mechanical resistance.
  • Bright alloy, not tarnishing.
  • Very good electrical conductivity.
  • Lead-free

 

Standard :

  • International :        Metal : ISO 9453      Flux : ISO 9454.1
  • French:                      Metal : NF   EN 29453 – C 90550

Physico-Chimical Characteristics

  • Tin rate, Sn : …………………………….. Rest
  • Copper rate, Cu : ………………………… 0.45 % à 0.9 %
  • Melting temperature : ………………….. 227°C
  • Specific gravity : …………………………. 7.3
  • Mechanical Strength : ………………….. Brinell hardness: 14
  • Electric conductance: …………………… 14 % IACS
  • Electric resistance: …………………………… 12 µ Ώ cm
  • Temperature of use for soldering iron: 380°- 390° C

QUALITY INSURANCE

Each delivery is identified by its manufacturing batch with the corresponding certificate of analysis

 Standard

  • International :                       Metal : ISO 9453 Flux : ISO 9454.1
  •  French:                                    Metal : NF   EN 29453 – C 90550