SN100(403)Cle+

Application

For refilling an existing lead-free-HASL solder bath “SN100(403)CL”.

Properties

Note:

Optimal solder characteristic like, improved wetting properties and lower dross formation will have an effect not till then Germanium have a value of 80 ppm.

For the HAL-application the Ni-endowment was optimized accordingly.

• metallic composition  :        99.9% Sn,
• endowment:            optimal Ni content for HASL (0.15%)
• adapted Ge content (0.0055%)
• lead impurity: max. 0.04 %

• melting range/ point  :        227°C (depends on copper content in the solder bath
• electrical conductivity:       7.5 m/ Wmm²
• density:                           7.33 g/cm³
• hardness Hv:                    14.1
• recommend tinning temp.:   277 °C