Alloy SAC305
Alloy S-Sn96.5 Ag3.5 Cu0.5 (SAC305)
General Characteristics
- Tin (Sn) 96.5% Silver (Ag) 3% Copper (Cu) 0.5% Ternary soldering alloy, lead free, used in the related electronic industry as well as in medical and food applications
- The lowest melting point of the lead free alloys: 217°C
- SAC305 solder bar very good mechanical strength
- Shinning alloy, good capillarity SAC305 bar solder
- Satisfying electric conductance
- Lowest Cost SAC305 Alloy
Physico-Chimical Characteristics
- Tin rate “Sn” Rest
- Copper rate « Cu » 0.3 % à 0.6 %
- Silver rate « Ag » 3,0 % à 3,4 %
- Melting temperature eutectic 217°C
- Specific gravity 7.3
- Mechanical Strength Brinell hardness :14.8 H.B.
- Electric conductance 14% IACS
- Electric resistance 12.3 µ Ώ cm
QUALITY INSURANCE
Each delivery is identified by its manufacturing batch with the corresponding certificate of analysis
Standard
International ISO 9453