SAC305 Solder Bar

Reference: SAC305 bar solder
TECHNICAL DATA SHEET

Alloy SAC305

 Alloy S-Sn96.5 Ag3.5 Cu0.5 (SAC305)

General Characteristics                                       

  • Tin (Sn) 96.5%  Silver (Ag) 3% Copper (Cu) 0.5% Ternary soldering alloy, lead free, used in the related electronic industry as well as in medical and food applications
  • The lowest melting point of the lead free alloys: 217°C
  • SAC305 solder bar very good mechanical strength
  • Shinning alloy, good capillarity SAC305 bar solder
  • Satisfying electric conductance
  • Lowest Cost SAC305 Alloy

Physico-Chimical Characteristics

  •  Tin rate “Sn”                            Rest
  • Copper rate « Cu »                  0.3 % à 0.6 %
  • Silver rate « Ag »                     3,0 % à 3,4 %
  • Melting temperature             eutectic 217°C
  • Specific gravity                        7.3
  • Mechanical Strength              Brinell hardness :14.8 H.B.
  • Electric conductance             14% IACS
  • Electric resistance                  12.3 µ Ώ cm

QUALITY INSURANCE

Each delivery is identified by its manufacturing batch with the corresponding certificate of analysis

 Standard

International                             ISO 9453